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Argosy Continues to Implement Its Sustainability Vision

Suining Linktek is advancing toward renewable energy (RE)Suining factory activated 303,000sqm solar power in Jun. 2025, and thus renewable energy accounts for more than 10% of total power consumption, which reduce 212.5 tCO2e. We are constantly move towards the dual goals of increasing RE and reducing carbon emissions. Argosy has published the 2024 Sustainability ReportIn 2025, Argosy published its first-ever…

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Argosy Technology (Vietnam) – A New Milestone for Argosy Research

Located in Industrial Park No. 05, Xuan Truc Commune, Hung Yen Prov., Argosy Technology Vietnam is only 45 km from Hanoi, providing excellent accessibility to major EMS companies and enabling faster service for local and regional customers. Recent Milestones Phase 1, including the main factory, office, and auxiliary facilities, has been fully completed with a total area of 17,350 sqm,…

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Congratulations to Kunshan Linktek on Being Recognized as a National-level “Little Giant” Enterprise!

Recently, Kunshan Linktek Electronic Co., Ltd has been successfully selected as a National-level Specialized, Refined, Differentiated, and Innovative “Little Giant” Enterprise, an authoritative recognition from the state for the company’s path of specialized development. Currently, only about 10,000 enterprises nationwide have received this honor, while Kunshan City has over 120 enterprises on the list, making it the first county-level city…

MORECongratulations to Kunshan Linktek on Being Recognized as a National-level “Little Giant” Enterprise!

Update on LPCAMM2 & NPI of CABB

Update on LPCAMM2 As part of the connector contributors in JEDEC, Argosy has participated in the development of LPCAMM2 connectors (incl. top cover and back plate), module assembly spec., and performance requirements. Expect to the existing 644-pin LPCAMM2, we also introduced a new 666-pin LPCAMM2 based on JEDEC standards. Two kinds of top cover options are now available, which are…

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Argosy_ODCC 2025

Thank you for visiting Argosy at the ODCC Summit 2025

The ODCC Summit 2025 has successfully concluded, and Argosy sincerely thanks you for taking the time to visit our booth and for your support and encouragement. At the exhibition, we highlighted high-speed connector solutions applied to servers and data center infrastructure, including SOCAMM2, DDR5 DIMM, M.2 Gen 5, PCIe CEM 5.0, and SPI. We also shared our latest achievements in…

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ODCC 2025

Looking forward to meeting you at the ODCC 2025

We sincerely invite you to visit the ODCC Summit 2025! Open Data Center Committee Summit 2025Date: September 9-11, 2025Location: Beijing International Convention CenterBooth number: A7, 1st Floor We will be showcasing a comprehensive range of high-performance connector solutions. You could expect a diverse range of products, including SOCAMM2, DDR5 DIMM, M.2 Gen 5, PCIe CEM 5.0, Type-C TBT5, LPCAMM2, and…

MORELooking forward to meeting you at the ODCC 2025

Introducing LPDDR5 SOCAMM2 Connector

LPDDR5 SOCAMM2 IntroductionSOCAMM (Small Outline Compression Attached Memory Module) is a next-generation compression attached memory module standard proposed by NVIDIA, specifically designed for high-performance computing platforms such as AI servers (e.g., GB300), edge computing, and embedded systems. Building upon the JEDEC CAMM (Compression Attached Memory Module) form factor, SOCAMM offers modularity, low power consumption, and high performance. SOCAMM2 is currently…

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Argosy’s First Sustainability Report Officially Released

To comprehensively communicate its sustainability strategies and achievements and to strengthen engagement with stakeholders, Argosy officially released its first Sustainability Report in June this year. The report has been uploaded to the company’s official website for public viewing and download. Through this report, readers can gain deeper insights into Argosy’s vision, practices, and progress in sustainable development across Environmental, Social,…

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Launched Floating BTB Connectors

Global connector sales reaches US$81.9 billion (Bishop, 2025), of which PCB connections account for more than 25%, mainly divided into Board-To-Board (BTB), Wire-To-Board (WTB), Pin Header, Terminal Block, Socket, etc. According to multiple research institutions, BTB connectors account for 10-15% of the total connector sales, with a CAGR of about 5-7% by 2030. Among this category, “Floating BTB” is being…

MORELaunched Floating BTB Connectors
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JEDEC and Argosy DDR5 SODIMM Status

DDR5 Market Info. Many market researchers forecasted the DDR5 shipment will increase to over 20% in 2022. Though the DDR5 began shipment in 2021, but the delay of new CPU makes DDR5 adoption slower. It’s expected DDR5 to achieve around 10% market adoption by end of 2022, and increase to 20% by 2023 and excess DDR4 by 2024. The CPU…

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