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[ CES 2026 Observation ] AI Server, Data Center & Drone Trending
<CES 2026 Observation> on AI Server, Data Center & Drone Trending In CES 2026 Observation Part 2, we will focus on AI server, data center and drone trending, to see how AI drives hardware development! Report Highlights ● AI Server & DC trending: from AMD’s CES keynote findings to state-off-the-art hardware designs of AI computing● Drone trending: from various drone…
[ CES 2026 Observation ] PC, Mainboard & Wearable Devices Trend
CES 2026 Observation on PC, Mainboard & Wearable Devices Trend Argosy focuses on CES 2026, observing trends in PCs, motherboards, and wearable devices, and releases the “PC, Motherboard, and Wearable Device Trends Report” to help you stay informed on the latest developments and trends in the AI PC and motherboard market. Report Highlights ● PC observation: CPU roadmap, highlights from…
Computex 2025 Observation- PC, Mainboard & IPC Trend
Argosy dives deep into Computex 2025 with an exclusive release of the “PC, Mainboard, and IPC Trend Report,” giving you a comprehensive look at the key technologies and market dynamics in the AI era! Report Highlights: 📊【Computex 2025 Trend Report Part 2】 Click to download and stay updated on the latest industry trends and technology developments! 📘【Argosy Product Catalog June…
Computex 2025 Observation- DC, Server & Memory Trend
Argosy dives deep into Computex 2025 with an exclusive release of the “DC, Server, and Memory Trend Report,” giving you a comprehensive look at the key technologies and market dynamics in the AI era! Report Highlights: 📊【Computex 2025 Trend Report Part 1】 Click to download, stay updated on the latest industry trends and technology developments!
JEDEC and Argosy DDR5 SODIMM Status
DDR5 Market Info. Many market researchers forecasted the DDR5 shipment will increase to over 20% in 2022. Though the DDR5 began shipment in 2021, but the delay of new CPU makes DDR5 adoption slower. It’s expected DDR5 to achieve around 10% market adoption by end of 2022, and increase to 20% by 2023 and excess DDR4 by 2024. The CPU…
Connector Industry Status and Trend
Sequence of incidents happened in the past few years: Trade War, Cybersecurity awareness, COVID-19 & variants, container freight backlog and RU-UA War that caused global supply chain crisis. According to Bishop, global connector sales performance dropped to $62.7 billion in 2020 with 2.3% YoY decline. However, it skyrocketed to $78 billion in 2021 with 24.4% YoY growth, and each quarter…
Type-C Connector New Release and Market Status
Type-C / USB-C Market Status The European Commission raised legislative proposal for making Type-C a common charger for mobile smartphones, tablets, cameras, headphones, portable speakers and handheld video-game consoles in Sep. 2021. So far, Type-C has been used in many applications, such as mobile devices (smartphone & wearable), PCs (incl. monitor), accessories (hub, adaptor & power bank), storage (SSD &…
M.2 Moving Toward Gen 4 Gen 5 and How M.2 Socket Development
M.2 Development M.2 was initially created to replace mSATA and Mini PCI Express interfaces, and now has been widely used as the interconnection for PCIe, DisplayPort, USB 3.0 and many other extension interfaces. In Q4 2020, PCI-SIG published M.2 Gen 4 (16 GT/s) Standard Version 1.0 on both sockets and modules. Shortly after, they also released M.2 Gen 5 (32 GT/s) proposed solution…
DDR5 DIMM Socket Status and DDR4 Spec Comparison
DDR5 DIMM Socket Status JEDEC began initial DDR5 socket standard (also called DDR5 connector) in 2018, and delivered several proposed versions based on global socket makers’ performance in 2019 and 2020. JEDEC works with partners (e.g. Intel) to conduct socket performance tests, including high-temperature warpage (similar to 3D X-ray soldering ability test based on IPC-A-610 standard) and signal integrity (SI) tests.…
DDR5 SO-DIMM Socket Status and DDR4 Spec Comparison
DDR5 SO-DIMM Socket Status JEDEC began initial DDR5 socket standard (also called DDR5 connector) in 2018, and delivered several proposed versions based on global socket makers’ performance in 2019 and 2020. JEDEC works with partners (e.g. Intel) to conduct socket performance tests, including high-temperature warpage (similar to 3D X-ray soldering ability test based on IPC-A-610 standard) and signal integrity (SI) tests.…