Update on LPCAMM2
As part of the connector contributors in JEDEC, Argosy has participated in the development of LPCAMM2 connectors (incl. top cover and back plate), module assembly spec., and performance requirements. Expect to the existing 644-pin LPCAMM2, we also introduced a new 666-pin LPCAMM2 based on JEDEC standards. Two kinds of top cover options are now available, which are designed to enhance both mechanical retention and thermal performance. Argosy’s LPCAMM2 connector solutions has already been delivered to several notebook brands and models. The LPCAMM2 enable higher capacity and data rate, furthermore our solution offers customers better design flexibility for high computing device development.
Argosy LPCAMM2 666 pins connector, top cover and back plate solutions
NPI of CABB
Leveraging CAMM2’s Compression Attached form factor, we’ve launched the customizable CABB connector (Compression Attached Board-to-Board). We tailor products to meet customer demand- interconnect mainboard with GPU board or daughterboard, significantly increasing design flexibility for laptops, workstations, and embedded systems.
Argosy CABB products
DDR6 DIMM Socket development status
As one of JEDEC’s major contributors in DDR5 DIMM sockets, Argosy is currently collaborating with JEDEC and Intel to develop the next-generation DDR6 DIMM sockets. JEDEC is expected to finalize the standard by the end of 2026. Samples from Argosy have already been delivered for validation. Stay tuned for the latest updates.
【Argosy’s Product Catalog Oct. 2025 Edition Released】
Click to download for full details on the latest product spec.
