LPDDR5 SOCAMM2 Introduction
SOCAMM (Small Outline Compression Attached Memory Module) is a next-generation compression attached memory module standard proposed by NVIDIA, specifically designed for high-performance computing platforms such as AI servers (e.g., GB300), edge computing, and embedded systems. Building upon the JEDEC CAMM (Compression Attached Memory Module) form factor, SOCAMM offers modularity, low power consumption, and high performance. SOCAMM2 is currently under proposal and discussion within JEDEC.
SOCAMM features (comparing to DDR5 RDIMM and HBM4)
(1) Modular Design – simplifies upgrades and maintenance
(2) Lower Power Consumption – consumes only one-third the power of DDR5 RDIMM, achieving up to 50% total power savings
(3) Compact Form Factor – occupies only one-third the space of DDR5 RDIMM
(4) High Bandwidth – delivers 2.5 times the bandwidth of DDR5 RDIMM
(5) Faster Data Rates – supports speed up to 9,600 MT/s, compared to 8,800 MT/s for DDR5 RDIMM
(6) Cost Efficiency – approximately one-third the cost of HBM4
(7) High Capacity Support – support memory capacities up to 128GB, compared to 64GB for HBM
Argosy has been heavily engaged in the development of compression connectors since joining as one of the LPDDR5 CAMM2 contributors. We hereby announce our latest product – LPDDR5 SOCAMM2 connector, and samples are ready for verification.
LP5 SOCAMM2 Connector Spec.
- 694 pins, pitch 0.93 x 1.60mm
- Dimension 86.70(L) x 14.00(W) x 1.00(H)mm
- 1.0A per pin ratings, 25 cycles durability
- SOCAMM2 is dual-channel that supports up to 128GB LPDDR5
SOCAMM Application
- For High-Performance Computing, e.g. AI PC, Workstation, Server, Edge computing
- Embedded systems for industrial and instrumentation
