Milestones

2025

Received CDP ratings: Climate Change B, Water Resources B-

Rated as HP’s “No.1 Strategic Supplier (HPSS)” for 7 consecutive years from 2018 to 2024

From 2021 to 2024, DDR SODIMM and M.2 products maintained over 45% global market share in computers

2024

Type-C connector received Intel Thunderbolt 5 upgrade certification

Vietnam Hanoi RO launched, Phase 1 factory construction started with 16,400 sqm

Kunshan factory recognized as a “Jiangsu Province Green Factory”

2023

Received CDP ratings: Climate Change C, Water Resources C

Kunshan factory obtained 3 certifications: ISO 14064-1, ISO 14067, and ISO 50001

2022

Hsinchu and Kunshan factories received RBA 7.0 SILVER-level certification

2021

Type-C obtained Intel Thunderbolt 4 Qualifications (global first stage listed)

2020

Type-C obtained USB4 & TID Qualifications (world first batch of USB4 connectors)

DDR SO-DIMM & M.2 raised to over 50% global NB market share

2019

Join design DDR5 sockets standards with JEDEC & Intel

Developed Micro Stamping Parts for mobile Wi-Fi & UWB modules

2018

DDR SO-DIMM & M.2 occupied over 40% global NB market share

Kunshan Linktek was audited and validated of RBA 6.0

HCF factory awarded IATF 16949: 2016 Certificate

2017

Awarded by Wistron as Excellent Quality Management Supplier in 2016 & 2017

HCF factory was audited and validated as Silver Certificate of EICC 5.1

2012

Suining Linktek factory established

Kunshan Linktek relocated to the new plant in Q2

Merged Super Link Electronics

2007

Acquired Linktek Co. as a subsidiary in Q4, and merged in Jan. 2009

2006

Kunshan Linktek factory established

2004

IPO on 30 April with capital USD 9.45 millions

2002

Hsinchu factory established

2001

Cooperated with Dr. Chu, Bong-Foo and developed the first Chinese e-book

1999

Linktek Co. established: agency & distribution for Japan Honda Connectors

Cooperated with Aurora to release PDA

1987

Founded on 5 Aug. with capital USD 91,000. First product is Logic Analyzer