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Introducing LPDDR5 SOCAMM2 Connector

LPDDR5 SOCAMM2 IntroductionSOCAMM (Small Outline Compression Attached Memory Module) is a next-generation compression attached memory module standard proposed by NVIDIA, specifically designed for high-performance computing platforms such as AI servers (e.g., GB300), edge computing, and embedded systems. Building upon the JEDEC CAMM (Compression Attached Memory Module) form factor, SOCAMM offers modularity, low power consumption, and high performance. SOCAMM2 is currently…

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Launched Floating BTB Connectors

Global connector sales reaches US$81.9 billion (Bishop, 2025), of which PCB connections account for more than 25%, mainly divided into Board-To-Board (BTB), Wire-To-Board (WTB), Pin Header, Terminal Block, Socket, etc. According to multiple research institutions, BTB connectors account for 10-15% of the total connector sales, with a CAGR of about 5-7% by 2030. Among this category, “Floating BTB” is being…

MORELaunched Floating BTB Connectors
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Introducing PCIe Gen 5 CEM Connector

Introduction of PCIe Gen 5 CEM connector The PCIe Gen 5 CEM connector is specifically designed to meet the high-performance demands of next-generation computing systems, supporting data transfer speeds of up to 32 GT This makes it ideal for high-demand applications such as data centers, artificial intelligence, and high-performance computing. It not only complies with PCIe Gen 5 specifications, ensuring stable…

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Introducing Type-C Thunderbolt 5 Connectors

USB Type-C/ USB-C Thunderbolt 5 Introduction Intel announced Thunderbolt 5 technology (or called TBT5) in Sep. 2023, and launched new control chip “Barlow Ridge”. Soon after, the Thunderbolt 5 certification was granted to all Thunderbolt 4 certified connectors in Dec. 2023. Therefore Argosy’s 4 part# was the world’s first batch of connectors upgraded from Thunderbolt 4 to Thunderbolt 5. It is…

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Introducing LPDDR5 CAMM2 Connector

LPDDR5 CAMM2 Introduction CAMM2 refers to Compression Attached Memory Module Gen 2. The “CAMM” was first introduced by Dell, and was promoted to JEDEC in 2022. JEDEC began the standard discussion and proposed the “CAMM2” solution in 2023. Eventually, JEDEC published the “CAMM2 Common Standard” in Q4 2023, to define both CAMM2 module and connector. CAMM2 has five features (1)support…

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