Argosy Introduces the New Slim Card Edge Connector
Advancing High-Speed Board-to-Board Interconnect Design
As AI computing, cloud infrastructure, and high-performance computing (HPC) continue to advance, server platforms demand higher bandwidth, greater system density, and more efficient system integration. Beyond supporting high-speed signal transmission, designers must also optimize power delivery, signal integrity, and modularity within increasingly compact system architectures.
To address the growing interconnect requirements of next-generation computing platforms, Argosy proudly introduces its new Slim Card Edge Connector. Supporting PCIe Gen 5 high-speed transmission, the connector integrates power and signal within a single interface, providing an efficient and flexible board-to-board interconnect solution for high-density, high-performance server systems.
(For reference only)
From Conventional Board-to-Board Connectors to Slim Card Edge
The Argosy Slim Card Edge Connector features a Straddle Mount Type design, allowing the I/O board or the Daughterboard to be directly mounted across the connector. This architecture effectively reduces overall connector stack height while improving PCB layout flexibility and maximizing space utilization.
By integrating both power delivery and high-speed signal transmission into a single interface, the connector simplifies system interconnect architecture, reduces design complexity, and delivers the integration and reliability required by today’s high-performance computing platforms.
Key Advantages of the Slim Card Edge Connector
Integrated Power and Signal
A single interface supports both power delivery and high-speed signal transmission, simplifying system interconnect design
Enhanced Space Utilization
The Straddle Mount Type design reduces connector stack height and improves PCB layout flexibility, making it ideal for high-density board-to-board applications.
Built for High-Performance Computing
Supports the PCIe Gen 5 interface for demanding HPC, cloud infrastructure, and edge computing applications
Product Spec.
– Straddle Mount Type
– 124 Pins
– 0.65 mm Pitch
– Signal Pin Current Rating：0.5A / pin
– Power Pin Current Rating：1A / pin
– Durability：200 Cycles
– Operating Temperature：-55°C ~ +105°C
– Support Daughterboard mating thickness 2.36 mm; Motherboard mating thickness 2.92 mm
– Samples Available
* Argosy provides co-development capability with customers to meet various PCB thickness and application requirements
Applications
– AI Computing
– Cloud Infrastructure
– Enterprise Storage Systems
– Edge Computing Platforms
– High-Performance Computing（HPC）
– High Speed Board-to-Board module
📘【Argosy Product Catalog Jun. 2026 Edition】
Click to download for full details on the latest product specs and applications!
