Milestones

  • 2021

    Type-C obtained Intel Thunderbolt 4 Qualifications (global first stage listed)

  • 2020

    Type-C obtained USB4 & TID Qualifications (world first batch of USB4 connectors)


    DDR SO-DIMM & M.2 raised to over 50% global NB market share

  • 2019

    Defined DDR5 sockets standards with JEDEC & Intel


    Developed Micro Stamping Parts for mobile Wi-Fi & UWB modules

  • 2018

    DDR SO-DIMM & M.2 occupied over 40% global NB market share


    Kunshan Linktek was audited and validated of RBA 6.0


    HCF factory awarded IATF 16949: 2016 Certificate

  • 2017

    Awarded by Wistron as Excellent Quality Management Supplier in 2016 & 2017


    HCF factory was audited and validated as Silver Certificate of EICC 5.1

  • 2016

    Suining Linktek factory established


    Kunshan Linktek relocated to the new plant in Q2


    Merged Super Link Electronics

  • 2007

    Acquired Linktek Co. as a subsidiary in Q4, and merged in Jan. 2009

  • 2006

    Kunshan Linktek factory established

  • 2004

    IPO on 30 April with capital USD 9.45 millions

  • 2002

    Hsinchu factory established

  • 2001

    Cooperated with Dr. Chu, Bong-Foo and developed the first Chinese e-book

  • 1999

    Linktek Co. established: agency & distribution for Japan Honda Connectors


    Cooperated with Aurora to release PDA

  • 1987

    Founded on 5 Aug. with capital USD 91,000. First product is Logic Analyzer